

The 2026 International Conference on Materials Science and Intelligent Computing ( MSIC 2026 ) will be held in Beijing from November 6 to 8, 2026. As an international academic exchange platform with important influence in the field of materials science and intelligent computing, MSIC 2026 aims to bring together top experts and scholars from universities, scientific research institutions and enterprises around the world to share the latest research progress and innovative technologies, and promote the deep integration and cross-border cooperation of related disciplines.
This conference focuses on the two core areas of ' material science ' and ' intelligent computing ', focusing on cutting-edge hotspots and application breakthroughs, and promoting the close integration of theoretical innovation and engineering practice. MSIC 2026 not only builds a high-quality academic exchange and cooperation platform for participants, but also provides a broad stage for displaying the latest scientific research results and technology applications, helping to promote the innovative development of materials science and intelligent computing technology.
We sincerely invite experts and scholars to actively participate in the conference and contribute to the event, jointly promote the academic exchange and technological progress in the field of material science and intelligent computing, and create a better scientific research future.
We are pleased to invite you to submit an abstract/manuscripts to present your work in this important scientific event. Previous proceedings were both indexed by EI Compendex and Scopus.
![]() | November 6-8,2026 Conference Dates |
![]() | August 22, 2026 Full Paper Submission Date |
![]() | October 26, 2026 Registration Deadline |
![]() | October 26, 2026 Final Paper Submission Date |


Material Synthesis and Process Innovation;Nanomaterials and Nanostructure Design ; ...

Machine learning auxiliary material design;Computational Materials Science and Multiscale Modeling; ...

Additive manufacturing and 3D printing materials;Material preparation process monitoring and physical mechanism ; ...

Smart Sensing Materials and Devices;Flexible electronic materials and wearable technology;...
All papers submitted to MSIC 2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.